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Atomically Thin Mica Flakes and Their Application as Ultrathin Insulating Substrates for Graphene
Castellanos-Gomez, A., Wojtaszek, M., Tombros, N., Agrait, N., van Wees, B. J., Rubio-Bollinger, G. & Agraït, N., 5-Sep-2011, In : Small. 7, 17, p. 2491-2497 7 p.Research output: Contribution to journal › Article › Academic › peer-review
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Atomically Thin Mica Flakes and Their Application as Ultrathin Insulating Substrates for Graphene. / Castellanos-Gomez, Andres; Wojtaszek, Magdalena; Tombros, Nikolaos; Agrait, Nicolas; van Wees, Bart J.; Rubio-Bollinger, Gabino; Agraït, Nicolás.
In: Small, Vol. 7, No. 17, 05.09.2011, p. 2491-2497.Research output: Contribution to journal › Article › Academic › peer-review
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TY - JOUR
T1 - Atomically Thin Mica Flakes and Their Application as Ultrathin Insulating Substrates for Graphene
AU - Castellanos-Gomez, Andres
AU - Wojtaszek, Magdalena
AU - Tombros, Nikolaos
AU - Agrait, Nicolas
AU - van Wees, Bart J.
AU - Rubio-Bollinger, Gabino
AU - Agraït, Nicolás
PY - 2011/9/5
Y1 - 2011/9/5
N2 - By mechanical exfoliation, it is possible to deposit atomically thin mica flakes down to single-monolayer thickness on SiO(2)/Si wafers. The optical contrast of these mica flakes on top of a SiO(2)/Si substrate depends on their thickness, the illumination wavelength, and the SiO(2) substrate thickness, and can be quantitatively accounted for by a Fresnel-law-based model. The preparation of atomically thin insulating crystalline sheets will enable the fabrication of ultrathin, defect-free insulating substrates, dielectric barriers, or planar electron-tunneling junctions. Additionally, it is shown that few-layer graphene flakes can be deposited on top of a previously transferred mica flake. Our transfer method relies on viscoelastic stamps, as used for soft lithography. A Raman spectroscopy study shows that such an all-dry deposition technique yields cleaner and higher-quality flakes than conventional wet-transfer procedures based on lithographic resists.
AB - By mechanical exfoliation, it is possible to deposit atomically thin mica flakes down to single-monolayer thickness on SiO(2)/Si wafers. The optical contrast of these mica flakes on top of a SiO(2)/Si substrate depends on their thickness, the illumination wavelength, and the SiO(2) substrate thickness, and can be quantitatively accounted for by a Fresnel-law-based model. The preparation of atomically thin insulating crystalline sheets will enable the fabrication of ultrathin, defect-free insulating substrates, dielectric barriers, or planar electron-tunneling junctions. Additionally, it is shown that few-layer graphene flakes can be deposited on top of a previously transferred mica flake. Our transfer method relies on viscoelastic stamps, as used for soft lithography. A Raman spectroscopy study shows that such an all-dry deposition technique yields cleaner and higher-quality flakes than conventional wet-transfer procedures based on lithographic resists.
KW - FEW-LAYER GRAPHENE
KW - SINGLE-LAYER
KW - FILMS
KW - GRAPHITE
KW - CRYSTALS
KW - SILICON
KW - SHEETS
KW - SIO2
U2 - 10.1002/smll.201100733
DO - 10.1002/smll.201100733
M3 - Article
VL - 7
SP - 2491
EP - 2497
JO - Small
JF - Small
SN - 1613-6810
IS - 17
ER -
ID: 5406901