Atomically Thin Mica Flakes and Their Application as Ultrathin Insulating Substrates for GrapheneCastellanos-Gomez, A., Wojtaszek, M., Tombros, N., Agrait, N., van Wees, B. J., Rubio-Bollinger, G. & Agraït, N., 5-Sep-2011, In : Small. 7, 17, p. 2491-2497 7 p.
Research output: Contribution to journal › Article › Academic › peer-review
By mechanical exfoliation, it is possible to deposit atomically thin mica flakes down to single-monolayer thickness on SiO(2)/Si wafers. The optical contrast of these mica flakes on top of a SiO(2)/Si substrate depends on their thickness, the illumination wavelength, and the SiO(2) substrate thickness, and can be quantitatively accounted for by a Fresnel-law-based model. The preparation of atomically thin insulating crystalline sheets will enable the fabrication of ultrathin, defect-free insulating substrates, dielectric barriers, or planar electron-tunneling junctions. Additionally, it is shown that few-layer graphene flakes can be deposited on top of a previously transferred mica flake. Our transfer method relies on viscoelastic stamps, as used for soft lithography. A Raman spectroscopy study shows that such an all-dry deposition technique yields cleaner and higher-quality flakes than conventional wet-transfer procedures based on lithographic resists.
|Number of pages||7|
|Publication status||Published - 5-Sep-2011|
- FEW-LAYER GRAPHENE, SINGLE-LAYER, FILMS, GRAPHITE, CRYSTALS, SILICON, SHEETS, SIO2